Model Tracks Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates (imec)

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.” Abstract: “Bonding and assembly processes have started to take the centre-stage in semiconductor manufacturing as they enable three-dimensional (3D) stacking and heterogeneous integration for novel interconnect architectures of integrated circuits. The progression of a bond front hinges on... » read more