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Optimizing Chiplet Placement And Interposer Footprint For 2.5D Systems (A*STAR)

Semiconductor Engineering
Optimizing Chiplet Placement And Interposer Footprint For 2.5D Systems (A*STAR)
Researchers from A*STAR published a technical paper titled “FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems.” Abstract Excerpt: ” We propose FAPlace, a footprint aware mask guided sequential placement framework. FAPlace operates on a sufficiently large canvas, eliminating the circular dependency by allowing the optimal interposer footprint to emerge as an... » read more

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