Generative Design Optimizes Liquid-Cooling Channels For 2.5D And 3D Packages (UM-Dearborn)

Researchers from University of Michigan-Dearborn published a technical paper titled “Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging.” Abstract Excerpt: The paper presents “a physics-guided generative design framework for liquid cooling channel topology optimization” in a “2.7 kW multi-chip package containing two high power GPUs and one CPU.”... » read more