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3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)

Semiconductor Engineering
3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)
Researchers at imec and Vrije Universiteit Brussels published “Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI.” Abstract “GPU compute resources are scaling to support growing AI workloads, leading to further rises in the climate change impact of hyperscale data centers that rely on high-performance GPUs. To model how packaging decisions... » read more

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